Industrial Visit to Nano Electrotech Pvt. Ltd.
22nd September 2016
ISTE Student Chapter of Dronacharya College of Engineering, Gurgaon organized an industrial visit to Nano Electrotech Pvt. Ltd., Noida on 22nd September 2016 with the aim of providing the students a brief understanding of PCB manufacturing. Mrs. Poonam Yadav (Assistant Professor, ECS Dept.) along with 24 students from ECS and EEE Departments of DCE, Gurgaon visited the company.
Nano Electrotech Pvt. Ltd. was established in 2006 with the objective of customizing requirements on the Printed Circuit Board design and manufacturing fronts through application of human skill coupled with cutting edge technology to deliver PCB solutions as per client requirements.
Our team was welcomed by Mr. Ankur Dwivedi (Operation Coordinator, Nano Electrotech Pvt. Ltd.). Mr. Vivek Sharma (Training Specialist, Nano Electrotech Pvt. Ltd.) gave a presentation on the process of designing of PCB. He briefed about the components used to make PCB including Metal Core PCB’s with their applications and discussed the two types of machines which were used to place the components on PCB board. He also discussed the six levels of integration including PCB Design, PCB Fabrication, PCB assembly, Testing and Programming, Cable Assembly and Box Builds.
Students were divided in three groups after the seminar and they visited the various manufacturing units and R&D labs of PCB designing. Mr. Indra Singh Bohra (Training Head, Nano Electrotech Pvt. Ltd.) described in brief about the manufacturing process of a PCB including drilling, conductor plating, solder resist, testing and assembling. He explained that in PCB drilling, the components that have to be attached to the multi - layered PCB can be prepared only by VIAS drilling in which a pated - through hole is drilled in the shape of annular rings. Small drill bits that are made out of tungsten carbide are used for the drilling. A dremel drill press is normally used to punch the holes and for high volume production automated drilling machines are used. After that he defined the conductor plating process which is the outer layer of the PCB containing copper connections which do not allow solderability of the components. To make it solderable, the surface of the material has to be plated with gold, tin, or nickel. The next process he defined is solder resist which covers the other areas which are not to be solderable with a solder resist material. It is basically a polymer coating that prevents the solder from bringing traces and possibly creating shortcuts to nearby component leads. In industrial applications the next phase is testing in which PCB’s are tested by different methods such as Bed of Nails Test, Rigid Needle adaptor, CT scanning test, etc. The basic of all tests include a computer program which will instruct the electrical test unit to apply a small voltage to each contact point, and verify that a certain voltage appears at the appropriate contact points. The last step of PCB manufacturing is PCB assembling that includes the assembling of the electronic components on to the respective holes in the PCB. This can be done by through-hole construction or surfac - mount construction.
It was very educative experience for the students as they learnt to apply their theoretical knowledge into practical applications with industry standards. The visit enhanced the knowledge of the students as they could practically see the PCB manufacturing live demonstrations of electronic manufacturing industry.